Resin article having plating layer and manufacturing method thereof

ABSTRACT

There is provided with a method for manufacturing a resin article having a plating layer, obtained by forming a plating layer on a portion of the surface of a resin article. The surface of the resin article is treated with a mask material solution. A portion of the surface of the resin article is irradiated selectively with ultraviolet rays such that it is possible to apply an electroless plating catalyst to the portion of the surface of the resin article. An electroless plating catalyst is applied to the portion of the surface of the resin article irradiated with ultraviolet rays. A plating layer is formed on the portion of the surface of the resin article irradiated with ultraviolet rays, using electroless plating.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a resin article having a plating layerand a manufacturing method thereof.

2. Description of the Related Art

A resin article provided with a plating layer having a predeterminedpattern is useful as, for example, a wiring board, a conductive film, orthe like. A method in which electroless plating is used has been knownas a method for manufacturing such a resin article having a platinglayer.

For example, Japanese Patent Laid-Open No. 2008-094923 discloses amethod for manufacturing a wiring board using surface modification bymeans of ultraviolet rays. Specifically, first, the entire surface of acyclo-olefin polymer base material is irradiated with ultraviolet raysemitted from an ultraviolet lamp, and thus the surface of the basematerial is modified. An electroless plating layer is likely to bedeposited on the modified region. Thereafter, an alkali degreasingtreatment is performed on the base material. It is thought that thistreatment is performed in order to improve adhesion with the catalystions or a binder material that binds together catalyst ions and the basematerial, the plating layer, and the like by cleaning the surface, andby increasing hydrophilicity and forming fine surface roughness.Furthermore, a conditioning treatment is performed on the base material,and with this treatment, a binder material for binding together catalystions and the base material is applied to the base material. The catalystions are adsorbed on the binder material and reduced to deposit acatalyst metal, whereafter electroless plating is performed, and therebya metal plating layer is formed on the entire surface of the modifiedcyclo-olefin polymer material. Finally, photolithography and etching areperformed, whereby the metal plating layer is patterned so as to have adesired pattern.

Japanese Patent Laid-Open No. 2009-007613 discloses a method for forminga metal thin film pattern on the surface of a polyimide resin basematerial. Specifically, a resist pattern is formed on the surface of thepolyimide resin base material, and by performing alkali modification,addition of fine metal particles, and electroless plating on a portionexposed through an opening portion of the resist pattern, a metal thinfilm is formed on the opening portion of the resist pattern. Thepolyimide resin base material has particularly excellent heat resistancecompared to other resin base materials, and in one example, has a Tg of200° C. or more. Also, the polyimide resin base material has highmechanical strength, high versatility, and can also be processed into afilm, for example. For these reasons, most flexible substrates are madeof polyimide resin.

SUMMARY OF THE INVENTION

According to an embodiment of the present invention, a method formanufacturing a resin article having a plating layer, obtained byforming a plating layer on a portion of a surface of a resin article,includes: treating the surface of the resin article with a mask materialsolution; irradiating a portion of the surface of the resin articleselectively with ultraviolet rays such that it is possible to apply anelectroless plating catalyst to the portion of the surface of the resinarticle; applying the electroless plating catalyst to the portion of thesurface of the resin article irradiated with ultraviolet rays; andforming a plating layer on the portion of the surface of the resinarticle irradiated with ultraviolet rays, using electroless plating.

According to another embodiment of the present invention, a resinarticle having a plating layer is manufactured using a method including:treating a surface of a resin article with a mask material solution;irradiating a portion of the surface of the resin article selectivelywith ultraviolet rays such that it is possible to apply an electrolessplating catalyst to the portion of the surface of the resin article;applying the electroless plating catalyst to the portion of the surfaceof the resin article irradiated with ultraviolet rays; and forming aplating layer on the portion of the surface of the resin articleirradiated with ultraviolet rays, using electroless plating.

Further features of the present invention will become apparent from thefollowing description of exemplary embodiments (with reference to theattached drawings).

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a diagram illustrating a method for manufacturing a resinarticle having a plating layer according to an embodiment.

FIG. 2 is a flowchart for a method for manufacturing a resin articlehaving a plating layer according to an embodiment.

FIG. 3 is a diagram showing a mask used in an example and a comparativeexample.

FIG. 4 is a diagram illustrating a method for manufacturing a resinarticle having a plating layer according to an example and a comparativeexample.

DESCRIPTION OF THE EMBODIMENTS

Photolithography and etching are needed in order to form a plating layerhaving a desired pattern using the method disclosed in Japanese PatentLaid-Open No. 2008-094923. Also, a resist pattern needs to be formedusing photolithography in the method disclosed in Japanese PatentLaid-Open No. 2009-007613 as well. For this reason, the methodsdisclosed in Japanese Patent Laid-Open No. 2008-094923 and JapanesePatent Laid-Open No. 2009-007613 are problematic in terms of cost, andin that the environmental burden is high since a large amount of wasteliquid is produced.

According to an embodiment of the present invention, a plating layerhaving a desired pattern can be formed on a resin article at low cost.

The inventor knew of a technique in which the technique disclosed inJapanese Patent Laid-Open No. 2008-094923 is adapted such that insteadof irradiating the entire surface of a resin article with ultravioletrays, a portion of the surface of the resin article is selectivelymodified by being selectively irradiated with ultraviolet rays inaccordance with a desired pattern. With this technique, a plating layeris selectively deposited using electroless plating on the portionirradiated with ultraviolet rays. That is, a plating layer having adesired pattern can be obtained without using a photolithography step oran etching step.

However, the inventor encountered a problem in that even if such atechnique is used, the shape of the resulting plating layer is notstable in some cases. For example, the inventor found that depending onconditions such as the type of the resin article used, the plating layeris sometimes deposited also on a portion that was not irradiated withultraviolet rays. For example, in the case of using a polyimide resinbase material, when electroless plating was performed after performingselective irradiation with ultraviolet rays, the plating layer wasdeposited also on a portion that was not irradiated with ultravioletrays, and therefore a plating layer having a desired pattern was notobtained.

The inventor speculates that the reason for this is as follows. First,an example of the molecular structure of polyimide will be shown below.

Imide rings are opened by performing an alkali treatment on polyimide,and thereby a carboxyl group COOH, which is a chemical adsorption group,is produced as shown below.

According to the method disclosed in Japanese Patent Laid-Open No.2008-094923, the alkali degreasing treatment is performed, andconditioning treatment is performed using a binder solution(conditioner) that is usually alkaline. In such a case, it is thoughtthat the imide rings of polyimide are opened by the alkali degreasingtreatment and the conditioning treatment, whereby a chemical adsorptiongroup is produced also on a portion that was not irradiated withultraviolet rays. Also, since carbonyl groups (═O), which are chemicaladsorption groups, are present in the molecular structure of thepolyimide, wettability is high. For this reason, it is thought that theconditioner tends to be adsorbed on the polyimide even if the imiderings are not opened.

As a result of examination, the inventor found that the mask material onthe region irradiated with ultraviolet rays can be deactivated bytreating the surface of the resin article with a mask material solutionand thereafter performing selective irradiation with ultraviolet rays.When electroless plating was performed thereafter, the plating layer wasnot deposited on the portion that was not irradiated with ultravioletrays.

Using this new method made it possible to perform selective plating withgood reproducibility even in the case of using resin modified by analkali solution, or resin with high wettability. That is, a platinglayer having a desired pattern could be formed on a resin article at lowcost without using a photolithography step and an etching step.

Hereinafter, an embodiment according to which the present invention canbe applied will be described with reference to the drawings. However,the scope of the present invention is not limited to the followingembodiment.

A method for manufacturing a resin article 100 having a plating layeraccording to an embodiment of the present invention includes a modifyingstep, a first applying step, an ultraviolet ray irradiation step, asecond applying step, and a plating step. Hereinafter, each of thesesteps will be described with reference to FIGS. 1 and 2.

Modifying Step

In the modifying step (step S210), treatment for modifying at least aportion of a surface 120 of a resin article 110 is performed on theresin article 110 that needs to be modified in order to cause a platinglayer to be deposited thereon in the plating step. The modifying stepmakes it easier to deposit the plating layer on the resin article 110and makes it easier to attach the mask material in the first applyingstep. In an embodiment, the modifying step can be omitted for a resinarticle on which the plating layer can be deposited in the plating stepeven without performing modification, and to which the mask material canbe applied in the masking step. In 1 a in FIG. 1, the resin article 110and the resin article surface 120 are shown. In 1 b in FIG. 1, amodified resin article surface 130 of the resin article 110 resultingfrom the modifying step is shown.

There is no particular limitation on the material of the resin article110. In particular, the method for manufacturing of the presentembodiment can be used for the resin article 110 having a polyimideresin or a polyamide resin on its surface. Among these, the polyimideresin has excellent heat resistance and strength, and thereforesoldering (including reflow) can be performed on a wiring board obtainedby forming a plating layer pattern on a polyimide resin substrate.

The resin article 110, which includes a material that is modified by analkali solution, can also be used in the present embodiment. In anembodiment, a chemical adsorption group is produced on the surface ofthe resin article 110 due to hydrolysis caused by the alkali treatment.Examples of the chemical adsorption group include a hydroxyl group, acarbonyl group, a carboxyl group, and the like. Also, in an embodiment,the surface of the resin article 110 includes at least one of an imidebond, an amide bond, and an ester bond.

In the present embodiment, a resin article 110 constituted by a materialhaving high wettability can also be used. In an embodiment, the surfaceof the resin article 110 includes a material having at least one of ahydroxyl group, a carbonyl group, and a carboxyl group. A resin havingthis kind of functional group has high wettability.

There is no particular limitation on the shape of the resin article 110,and it can be in the form of a plate, film, or the like, for example.Also, the resin article 110 may be constituted by multiple resinmaterials, may have a structure in which multiple resin materials arelayered, or may be constituted by a compound material including acoating structure obtained by coating the surface of another materialwith a resin material.

Examples of modification methods include, but are not limited to,irradiation with ultraviolet rays, acid treatment using chromic acid orthe like, and alkali treatment using sodium hydroxide or the like. Also,it is possible to use two or more modification methods in combination inthe modification step.

In one embodiment, the resin article 110 is modified using an alkalisolution. That is, the resin article 110 has a property in which bondsbetween molecules on the surface thereof are cut by the alkalitreatment. Examples of resin materials that are easily modified by analkali treatment include polyimide resin, polyamide resin, polycarbonateresin, acrylic resin, and polyester resin.

For example, if polyimide resin is used as the resin article 110, whenthe alkali treatment is performed on the resin article 110, imide ringsare opened, and carboxyl groups or carboxyl ions are produced on thesurface 120 of the resin article 110. Since the carboxyl groups orcarboxyl ions have a high affinity with the later-described maskmaterial, the mask material is more easily adsorbed on the surface 120in the first applying step (step S220). For this reason, it is thoughtthat after the mask material at a region 150 irradiated with ultravioletrays is deactivated, electroless plating is more likely to be depositedon the surface of the resin article 110 modified by the alkalitreatment.

The alkali treatment may be performed on the entire resin surface 120,or it may be selectively performed on a portion of the resin surfacethat includes the region 150 irradiated with ultraviolet rays, whichwill be described later. In this case, the conditions for the alkalitreatment may be selected as appropriate, such that the plating layer isdeposited on the region 150 that is irradiated with ultraviolet rays andat which the mask material is deactivated, and the plating layer is notdeposited on the region that is not irradiated with ultraviolet rays andat which the mask material remains.

In an embodiment, the alkali treatment is performed by immersing theresin article 110 in an alkali treatment solution. For example, it ispossible to use an aqueous solution of an alkali metal hydroxide, analkali earth metal hydroxide, or the like as the alkali treatmentsolution. Specific examples of the alkali treatment solution include anaqueous solution of sodium hydroxide, an aqueous solution of potassiumhydroxide, and the like. After the alkali treatment, the resin article110 may be cleaned by washing with water, or the like.

First Applying Step

In the first applying step (S220), the mask material is applied to thesurface of the resin article 110 as shown in 1 c in FIG. 1. In 1 c inFIG. 1, a region 140 of the resin article 110 to which the mask materialhas been applied, resulting from the first applying step, is shown. Inthe case of using a resin article 110 having a property such that themask material attaches easily thereto, the above-described modifyingstep may be omitted. In an embodiment, each oxygen atom existing on themodified surface is high in electro-negativity and strongly attractselectrons in the molecule, and therefore has a negative charge. Inanother embodiment, imide bonds (—CONCO—) in primary chains of thepolyimide resin undergo imide ring opening due to the alkali treatmentin the modifying step, and thus have a negative charge. The maskmaterial may be thus applied to the surface of the resin having anegative charge or an adsorption group.

The mask material may include an ion polymer as a component. Ionpolymers include cation polymers, anion polymers, and non-ion polymers.Specifically, a mask material that easily attaches to the surface of theresin article 110 can be used. For example, in an embodiment in which aresin article 110 having a surface with a negative charge is used, acation polymer is used as the mask material. Thus, a mask materialhaving a charge opposite to that of the surface of the resin article 110can be used as a mask material that easily attaches to the surface ofthe resin article 110. In an embodiment, the mask material is in theform of a solution. Application of the mask material can be performed bytreating the surface of the resin article 110 with the mask materialsolution, and for example, it can be performed by bringing the maskmaterial solution into contact with the surface of the resin article. Inan embodiment, the first applying step may be performed by immersing theresin article 110 in the mask material solution. In another embodiment,the first applying step may be performed by spraying the mask materialsolution onto the resin article 110 or coating the resin article 110with the mask material solution.

It is thought that the mask material is deactivated due to the maskmaterial being selectively irradiated with ultraviolet rays in a laterstep. Then, in an even later step, a catalyst is adsorbed on the surfaceof the resin article 110, and thus an electroless plating layer isdeposited at that region. As long as a desired property is obtained, themask material may remain on the resin article having a plating layerafter all of the steps are complete, and there is no need to include astep of removing the mask material.

Ultraviolet Ray Irradiation Step

In an ultraviolet ray irradiation step (step S230), the resin article110 to which the mask material has been applied is selectivelyirradiated with ultraviolet rays, as shown in 1 d in FIG. 1. In 1 d inFIG. 1, the region 150 that was selectively irradiated with ultravioletrays, and the region 140 that was not irradiated with ultraviolet raysand to which a mask material was applied are shown. In the ultravioletray irradiation step, a region on at least a portion of the surface ofthe resin article 110 to which the mask material has been applied isirradiated with ultraviolet rays such that an electroless platingcatalyst can be applied to the portion of the surface of the resinarticle 110 to which the mask material has been applied. It is thoughtthat by performing irradiation with ultraviolet rays, the mask materialapplied to the surface of the resin article 110 is deactivated.

In an embodiment, the resin article 110 is irradiated with ultravioletrays in an atmosphere including at least one of oxygen and ozone. As aspecific example, the resin article 110 can be irradiated withultraviolet rays in air. In another embodiment, in order to furtherpromote the deactivation of the mask material, irradiation is performedin an atmosphere including ozone.

For example, upon performing irradiation with ultraviolet rays having aspecific wavelength or less that can decompose oxygen in an atmosphereincluding oxygen, the oxygen in the atmosphere is decomposed to produceozone. Furthermore, active oxygen is produced in the process ofdecomposing ozone.

The energy of a photon having a specific wavelength can be representedby the following equation.

E=Nhc/λ(KJ·mol⁻¹)

N=6.022×10²³ mol⁻¹ (Avogadro's number)

h=6.626×10⁻³⁷ KJ·s (Planck constant)

c=2.988×10⁸ m·s⁻¹ (speed of light)

λ=light wavelength (nm)

Here, the binding energy of an oxygen molecule is 490.4 KJ·mol⁻¹. Thelight wavelength is approximately 243 nm when converted from the bindingenergy based on the equation for the energy of photons. This indicatesthat the oxygen molecules in the atmosphere absorb ultraviolet rayshaving a wavelength of 243 nm or less and are decomposed. As a result,ozone O₃ is produced. Furthermore, during decomposition of ozone, activeoxygen is produced. At this time, if ultraviolet rays having awavelength of 310 nm or less are present, ozone is efficientlydecomposed to produce active oxygen. Furthermore, ultraviolet rayshaving a wavelength of 254 nm decompose ozone most efficiently.

O₂ +hν (243 nm or less)→O(3P)+O(3P)

O₂+O(3P)→O₃ (ozone)

O₃ +hν (310 nm or less)→O₂+O(1D) (active oxygen)

O(3P): oxygen atom in ground state

O(1D): oxygen atom in excited state (active oxygen)

There is no particular limitation on the method for irradiation withultraviolet rays, and for example, it is possible to use an ultravioletlamp, an ultraviolet LED, an ultraviolet laser, or the like. In anembodiment, the region 150 to be irradiated is irradiated withultraviolet rays emitted from an ultraviolet lamp or the like through aquartz chromium mask in which a desired pattern is formed. In anotherembodiment, the region 150 to be irradiated with ultraviolet rays isscanned with ultraviolet rays using ultraviolet rays from an ultravioletlaser or the like.

In the present embodiment, the portion of the surface of the resinarticle 110 on which the electroless plating is to be deposited isselectively irradiated with ultraviolet rays. It is thought that themask material applied to the surface of the resin article 110 isdeactivated at the portion irradiated with ultraviolet rays, and as aresult, an electroless plating catalyst can be applied thereto. Forexample, by performing irradiation with ultraviolet rays via a maskhaving an ultraviolet ray transmission portion with a shapecorresponding to the plating pattern to be deposited, the region 150 tobe irradiated with ultraviolet rays can be selectively irradiated withultraviolet rays. An example of the mask is shown in FIG. 3. Thephotomask 300 shown in FIG. 3 includes a substrate 310 that transmitsultraviolet rays, and a metal thin film 320 that is provided on thesubstrate 310 and does not transmit ultraviolet rays. The metal thinfilm 320 is patterned so as to have an opening having a shape thatcorresponds to the region 150 to be irradiated with ultraviolet rays.

There is no particular limitation on the wavelength of the ultravioletrays, and a wavelength that promotes deactivation of the mask materialapplied to the resin surface is selected. In an embodiment, thewavelength of the ultraviolet rays is 243 nm or less. Due to thewavelength being 243 nm or less, the deactivation of the mask materialon the surface of the resin article 110 is further promoted. Ultravioletrays with a wavelength of 243 nm or less can decompose oxygen in theatmosphere, and can produce ozone and active oxygen.

There is no particular limitation on the irradiation amount ofultraviolet rays, and the irradiation amount can be selected asappropriate such that the mask material of the region 150 irradiatedwith ultraviolet rays is deactivated and the plating is selectivelydeposited on the region 150 irradiated with ultraviolet rays. Ingeneral, it is thought that the larger the irradiation amount ofultraviolet rays is, that is, the higher the intensity of theultraviolet rays is or the longer the irradiation time is, the more thedeactivation of the mask material at the region 150 irradiated withultraviolet rays advances and the easier it is for the plating to bedeposited. However, the inventor confirmed, by means of an experiment,that the deposition of the plating deteriorates in some cases if theirradiation amount of ultraviolet rays exceeds an appropriate amount.The inventor speculates that the reason for this is that the modifiedlayer on the surface of the resin article 110 falls off when thedeactivation of the mask material advances and the ultraviolet raysreach the surface of the resin article 110.

In an embodiment, the cumulative irradiation amount of ultraviolet raysat the primary wavelength can be 600 mJ/cm² or more, or 800 mJ/cm² ormore. In an embodiment, the cumulative irradiation amount at the primarywavelength is 1200 mJ/cm² or less. In the present specification, unlessotherwise stated, the irradiation amount and irradiation intensity ofultraviolet rays indicate values at the primary wavelength. In thepresent specification, the primary wavelength indicates the wavelengthwith the highest intensity in a range of 243 nm and less. Specifically,in the case of using a low-voltage mercury lamp, the primary wavelengthis 185 nm.

The conditions for deactivating the mask material may change dependingon the type of the resin article 110, the existence of modification ofthe resin surface and the state thereof, the level of contamination ofthe surface of the resin article 110, the type of the mask material, thethickness of the mask material, the type of the plating solution, theconcentration, temperature, pH, and deterioration over time of theplating solution, variation in the output of the ultraviolet lamp, orthe like. In this case, it is sufficient that the irradiation amount ofultraviolet rays is determined as appropriate with reference to theforegoing values.

Second Applying Step

In the second applying step (step S240), an electroless plating catalystis applied to the surface of the resin article 110 irradiated withultraviolet rays. Specifically, as shown in 1 e in FIG. 1, anelectroless plating catalyst is applied to the region 150 irradiatedwith ultraviolet rays.

The electroless plating catalyst can be applied in accordance with aconventionally-known method. For example, the electroless platingcatalyst can be applied by using the following two steps.

The catalyst is applied by bringing a catalyst ion solution into contactwith the surface of the resin article 110. In an embodiment, thecatalyst may be applied by immersing the resin article 110 in thecatalyst ion solution. In another embodiment, the catalyst may beapplied by spraying the catalyst ion solution onto the resin article 110or coating the resin article 110 with the catalyst ion solution.

The catalyst ions are reduced by immersing the resin article 110 in asolution containing a reducing agent. Thus, the catalyst is deposited.Examples of the reducing agent include hydrogen gas, dimethylamineborane, sodium borohydride, and the like.

An electroless plating catalyst is used which easily attaches tolocations at which the mask material on the surface of the resin article110 is deactivated, and which is not likely to attach to the maskmaterial on the resin article 110. For example, the electroless platingcatalyst can be applied by using an electroless plating catalyst havinga charge opposite that of the surface of the resin article 110 after themask material has been deactivated. In this case, the electrolessplating catalyst selectively attaches to the region 150 irradiated withultraviolet rays. On the other hand, the electroless plating catalystdoes not attach to the region 140 that was not irradiated withultraviolet rays and to which the mask material was applied. Specificexamples of the electroless plating catalyst include a cation catalystsuch as an activator solution (product name ELFSEED ES-300, availablefrom JCU Corporation) containing a palladium complex (e.g., a palladium(II)-basic amino acid complex) having a positive charge in at least aportion thereof. A palladium-basic amino acid complex disclosed in WO2007/066460 can be used as another example of a palladium-basic aminoacid complex. It is possible to perform the second applying step (stepS240) by using an activator solution for electroless plating includingthis kind of electroless plating catalyst. This kind of palladiumcomplex having a positive charge in at least a portion thereof is likelyto interact with the chemical adsorption group produced on the surfaceof the resin article 110 after the mask material is deactivated.

Specific examples of the reducing agent include a cation activatingagent such as an accelerator solution (product name: ELFSEED ES-400,available from JCU Corporation).

Plating Step

In the plating step (step S250), the resin article 110 to which theelectroless plating catalyst has been applied is immersed in theelectroless plating solution. In if in FIG. 1, a resin article 100having a plating layer, in which a plating layer 170 has been depositedon the region 150 irradiated with ultraviolet rays, is shown.

There is no limitation on the specific method for electroless plating.Examples of electroless plating that can be used include electrolessplating using a formalin-based electroless plating bath, and electrolessplating using hypophosphorous acid as the reducing agent, which has aslow depositing speed but is easy to handle. Also, the plating layer 170may be formed using a high-speed electroless plating method in order toform a thicker plating layer. Further specific examples of electrolessplating include electroless copper plating, electroless copper nickelplating, and zinc oxide plating.

Electroless plating according to such a method can be performed using,for example, an electroless Cu—Ni plating solution (product name:AISL-520, available from JCU Corporation). In the case of usinghypophosphorous acid as the reducing agent, copper nickel plating inwhich nickel is used is performed in order to give the plating layerself-catalyzing properties.

The plating layer 170 formed using electroless plating in this way isoften thin, and therefore the thickness of the plating layer 170 may beincreased by further performing electrolytic plating. In 1 g in FIG. 1,the plating layer 180 whose thickness has been increased by furtherperforming electrolytic plating is shown. Examples of the material ofthe metallic layer provided using electrolytic plating include, but arenot limited to, copper, nickel, copper-nickel alloy, zinc oxide, zinc,silver, cadmium, iron, cobalt, chromium, nickel-chromium alloy, tin,tin-lead alloy, tin-silver alloy, tin-bismuth alloy, tin-copper alloy,gold, platinum, rhodium, palladium, and palladium-nickel alloy. Also,silver or the like may be deposited on the plating layer 170 bydisplacement plating.

According to the method of the present embodiment, the plating layer 170is deposited on the region 150 irradiated with ultraviolet rays byperforming electroless plating. On the other hand, even if electrolessplating is performed, the plating layer 170 is not deposited on theregion that was not irradiated with ultraviolet rays. For example, theplating layer is not deposited on the region adjacent to the region 150irradiated with ultraviolet rays. Thus, according to the method of thepresent embodiment, the plating layer 170 can be selectively depositedwith good reproducibility on the region 150 irradiated with ultravioletrays.

EXAMPLES Example 1

A polyimide plate (product name: Kapton EN200, thickness: 50 μm,available from DuPont-Toray Co., Ltd.) was used as a resin article 410.Table 1 shows the steps performed in Example 1.

TABLE 1 Step Treatment conditions Alkali treatment 50° C., 10 secondsMask material application 50° C., 2 minutes treatment Ultraviolet rayirradiation 10 minutes Catalyst application treatment 50° C., 5 minutesReduction treatment 35° C., 4 minutes Electroless copper nickel plating60° C., 5 minutes (Washing with water is performed as needed after eachstep)

Modifying Step

The resin article 410 and the resin article surface 420 are shown in 4 ain FIG. 4. First, the resin article 410 was subjected to an alkalitreatment. In 4 b in FIG. 4, a modified resin article surface 430 of theresin article 410 resulting from the modifying step is shown.Specifically, the resin article 410 was immersed for 10 seconds in anaqueous solution of sodium hydroxide adjusted so as to be 50° C. and0.90 mol/L, which is an alkali treatment solution used in a Cu—Niplating solution set “AISL” available from JCU Corporation. Thereafter,the resin article 410 was washed with water.

Mask Material Applying Step (First Applying Step)

Next, after undergoing the alkali treatment, the resin article 410 wassubjected to a mask material application treatment. In 4 c in FIG. 4,the surface 440 of the resin article 410 to which the mask material hasbeen applied, resulting from the mask material applying step, is shown.Specifically, the resin article 410 was immersed for 2 minutes at 50° C.using a conditioner solution used in the Cu—Ni plating solution set“AISL”, available from JCU Corporation. Thereafter, the resin article410 was washed with water.

Ultraviolet Ray Irradiation Step

Next, the portion on which the plating layer was to be formed on theresin article 410 was irradiated with ultraviolet rays via a photomaskin air. In 4 d in FIG. 4, a region 450 selectively irradiated withultraviolet rays is shown. The other region was not irradiated withultraviolet rays. The ultraviolet ray irradiation conditions were asfollows.

Low-voltage mercury lamp: UV-300 (primary wavelengths: 185 nm, 254 nm),available from Samco Corporation

Irradiation distance: 3.5 cm

Illuminance at irradiation distance of 3.5 cm: 5.40 mW/cm² (254 nm), and1.35 mW/cm² (185 nm)

Irradiation time: 10 minutes

The cumulative exposure amount at this time was 1.35 mW/cm²×600seconds=about 810 mJ/cm².

Catalyst Applying Step (Second Applying Step)

Next, the resin article 410 irradiated with ultraviolet rays wassubjected to a catalyst application treatment. As shown in 4 e in FIG.4, the electroless plating catalyst is applied to the surface of theresin article 410 that was irradiated with ultraviolet rays. Theelectroless plating catalyst binds to the region 450 irradiated withultraviolet rays. In 4 e in FIG. 4, a region 460 to which theelectroless plating catalyst was applied is shown. Specifically, theresin article 410 was immersed for 5 minutes at 50° C. using anactivator solution (product name: ELFSEED ES-300, available from JCUCorporation). At this time, the activator solution was used at threetimes the concentration specified by the manufacturer. Thereafter, theresin article 410 was washed with water. Thus, the catalyst ions wereapplied. Furthermore, the resin article 410 was immersed for 4 minutesat 35° C. using the accelerator solution (product name: ELFSEED ES-4,available from JCU Corporation). Thereafter, the resin article 410 waswashed with water. Thus, the catalyst ions were reduced.

Electroless Plating Step

Next, the resin article 410 resulting from the reduction treatment wassubjected to electroless copper nickel plating. Specifically, the resinarticle 410 was heated to 60° C. and immersed for 5 minutes using theelectroless Cu—Ni plating solution (product name: AISL-520, availablefrom JCU Corporation). Thereafter, the resin article 410 was washed withwater.

A resin article 400 having a plating layer shown in 4 f in FIG. 4 wasproduced using the treatments above. The resin article 400 having aplating layer was observed, and it was found that the plating layer 470was formed on the region 450 irradiated with ultraviolet rays, but noplating layer was formed on the portion that was not irradiated withultraviolet rays. Thus, it can be understood that the plating layer canbe formed selectively with good reproducibility according to the methodof Example 1.

Example 2

The resin article 410 having a plating layer was produced in a mannersimilar to that of Example 1, except for the fact that the resin article410 was irradiated with ultraviolet rays for 7 minutes in theultraviolet ray irradiation step. In Example 2 as well, the platinglayer 470 was formed on the region 450 irradiated with ultraviolet raysand no plating layer was formed on the portion that was not irradiatedwith ultraviolet rays.

Example 3

The resin article having a plating layer 410 was produced in a mannersimilar to that of Example 1, except for the fact that the resin article410 was irradiated with ultraviolet rays for 3 minutes in theultraviolet ray irradiation step. In Example 3, the plating layer 480was formed only on a portion of the region 450 irradiated withultraviolet rays. Also, no plating layer was formed on the portion thatwas not irradiated with ultraviolet rays. In 4 g in FIG. 4, the resinarticle 410 on which the plating layer 480 was formed in the presentexample is shown.

Example 4

The resin article 410 having a plating layer was produced in a mannersimilar to that of Example 1, except for the fact that the resin article410 was irradiated with ultraviolet rays for 5 minutes in theultraviolet ray irradiation step. In Example 4, the plating layer 490was not formed in narrow parts of the region 450 irradiated withultraviolet rays. Also, no plating layer was formed on the portion thatwas not irradiated with ultraviolet rays. In the present example, in 4 hin FIG. 4, the resin article 410 on which the plating layer 490 wasformed is shown.

Example 5

The resin article having a plating layer 410 was produced in a mannersimilar to that of Example 1, except for the fact that the resin article410 was irradiated with ultraviolet rays for 15 minutes in theultraviolet ray irradiation step. In Example 5, the plating layer wasnot sufficiently formed on the region 450 irradiated with ultravioletrays. Also, no plating layer was formed on the portion that was notirradiated with ultraviolet rays.

As described above, it was confirmed that the plating layer issufficiently deposited on the portion of the resin article selectivelyirradiated with ultraviolet rays by performing irradiation withultraviolet rays for an appropriate amount of time. The inventor alsofound that if there is originally-present damage on the resin surface orthe resin is damaged in a step of generating the plating layer, or thelike, the plating layer tends to spread out in the form of spikes at thedamaged portion. On the other hand, the inventor confirmed that theplating layer tends to withdraw inward from the boundary alongrecessions and protrusions caused by damage in the plating layerproduced using the methods of Examples 1 and 2. Due to thesecharacteristics, with the methods of Examples 1 and 2, it is possible toprevent the occurrence of defects such as a wiring pattern shortcircuiting.

Comparative Example 1

First, the resin article 410 was subjected to ultraviolet rayirradiation for 10 minutes using a procedure similar to that ofExample 1. Thereafter, the resin article 410 irradiated with ultravioletrays was subjected to an alkali treatment. Specifically, the resinarticle 410 was immersed for 2 minutes in an aqueous solution of sodiumhydroxide adjusted so as to be 50° C. and 0.90 mol/L, which is an alkalitreatment solution used in the Cu—Ni plating solution set “AISL”,available from JCU Corporation. Thereafter, the resin article 410 waswashed with water.

Furthermore, the resin article 410 subjected to the alkali treatment wassubjected to a conditioning treatment. Specifically, the resin article410 was immersed for 2 minutes at 50° C. using a conditioner solutionused in the Cu—Ni plating solution set “AISL”, available from JCUCorporation. At this time, the conditioner solution that was used wasdiluted to one-tenth the concentration designated by the maker. If theresin article is polyimide, the conditioner tends to remain in theportion that was not irradiated with ultraviolet rays due to the alkalitreatment in the previous step. For this reason, the conditioner usedwas diluted in order to achieve selectivity by causing the conditionerto remain on the portion irradiated with ultraviolet rays and making iteasier to rinse off the conditioner on the non-irradiated portion.Thereafter, the resin article 410 was washed with water. Next, the resinarticle 410 irradiated with ultraviolet rays was subjected to a catalystapplication treatment. Specifically, the resin article 410 was immersedfor 2 minutes at 50° C. using the activator solution (product name:AISL-ACT, available from JCU Corporation). Thereafter, the resin article410 was washed with water. Furthermore, the resin article 410 wasimmersed for 2 minutes at 40° C. using the accelerator solution (productname: acceleration treatment solution for AISL-520, available from JCUCorporation). Thereafter, the resin article 410 was washed with water.Thus, a catalyst ion reduction treatment was performed. Thereafter,electroless copper nickel plating was performed in a manner similar tothat of Example 1. In Comparative Example 1, the plating layer wasformed on both the portion irradiated with ultraviolet rays and theportion that was not irradiated with ultraviolet rays. Table 2 shows thesteps carried out in Comparative Example 1.

TABLE 2 Step Treatment Conditions Ultraviolet ray irradiation 10 minutesAlkali treatment 50° C., 2 minutes Conditioning treatment 50° C., 2minutes Catalyst application treatment 50° C., 2 minutes Reductiontreatment 40° C., 2 minutes Electroless copper nickel 60° C., 5 minutes.plating (Washing with water was performed as needed after each step)

While the present invention has been described with reference toexemplary embodiments, it is to be understood that the invention is notlimited to the disclosed exemplary embodiments. The scope of thefollowing claims is to be accorded the broadest interpretation so as toencompass all such modifications and equivalent structures andfunctions.

This application claims the benefit of Japanese Patent Application No.2014-261209, filed Dec. 24, 2014, which is hereby incorporated byreference herein in its entirety.

What is claimed is:
 1. A method for manufacturing a resin article havinga plating layer, obtained by forming a plating layer on a portion of asurface of a resin article, the method comprising: treating the surfaceof the resin article with a mask material solution; irradiating aportion of the surface of the resin article selectively with ultravioletrays such that it is possible to apply an electroless plating catalystto the portion of the surface of the resin article; applying theelectroless plating catalyst to the portion of the surface of the resinarticle irradiated with ultraviolet rays; and forming a plating layer onthe portion of the surface of the resin article irradiated withultraviolet rays, using electroless plating.
 2. The method formanufacturing a resin article having a plating layer according to claim1, further comprising modifying the surface of the resin article beforethe treating.
 3. The method for manufacturing a resin article having aplating layer according to claim 2, wherein the modifying furtherincludes treating the resin article with an alkali solution.
 4. Themethod for manufacturing a resin article having a plating layeraccording to claim 3, wherein a chemical adsorption group is produced onthe surface of the resin article due to the treatment with the alkalisolution.
 5. The method for manufacturing a resin article having aplating layer according to claim 1, wherein the surface of the resinarticle includes at least one of an imide bond, an amide bond, and anester bond.
 6. The method for manufacturing a resin article having aplating layer according to claim 1, wherein the surface of the resinarticle includes polyimide resin or polyamide resin.
 7. The method formanufacturing a resin article having a plating layer according to claim1, wherein the mask material includes a cation polymer.
 8. The methodfor manufacturing a resin article having a plating layer according toclaim 1, wherein in the irradiating, the portion of the surface of theresin article is irradiated with ultraviolet rays of 243 nm or less. 9.The method for manufacturing a resin article having a plating layeraccording to claim 1, wherein the irradiating is performed in anatmosphere including at least one of oxygen and ozone.
 10. The methodfor manufacturing a resin article having a plating layer according toclaim 1, wherein the applying includes bringing an electroless platingcatalyst solution or an electroless plating catalyst ion solution intocontact with the surface of the resin article.
 11. The method formanufacturing a resin article having a plating layer according to claim1, wherein the applying includes bringing an electroless platingcatalyst ion solution into contact with the surface of the resin articleand reducing the electroless plating catalyst ions, and the electrolessplating catalyst ions are palladium complexes having a positive chargein at least a portion thereof.
 12. A resin article having a platinglayer, manufactured using a method comprising: treating a surface of aresin article with a mask material solution; irradiating a portion ofthe surface of the resin article selectively with ultraviolet rays suchthat it is possible to apply an electroless plating catalyst to theportion of the surface of the resin article; applying the electrolessplating catalyst to the portion of the surface of the resin articleirradiated with ultraviolet rays; and forming a plating layer on theportion of the surface of the resin article irradiated with ultravioletrays, using electroless plating.